Semiconductor memory cell and driver circuitry with gate oxide formed simultaneously
The present disclosure provides for semiconductor structures and methods for making semiconductor structures. In one embodiment, isolation regions are formed in a substrate, and wells are formed between the isolation regions. The wells include a first low voltage well and a second low voltage well i...
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creator | HONG CHEONG MIN AKHTER TAHMINA MULLER GILLES J |
description | The present disclosure provides for semiconductor structures and methods for making semiconductor structures. In one embodiment, isolation regions are formed in a substrate, and wells are formed between the isolation regions. The wells include a first low voltage well and a second low voltage well in a logic region of the substrate, and a memory array well in an NVM region of the substrate. A first layer of oxide is formed over the first low voltage well and the memory array well, and a second layer of oxide is formed over the second low voltage well, the second layer being thinner than the first layer. Gates are formed over the wells, including a first gate over the first low voltage well, a second gate over the second low voltage well, and a memory cell gate over the memory array well. Source/drain extension regions are formed around the gates. |
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In one embodiment, isolation regions are formed in a substrate, and wells are formed between the isolation regions. The wells include a first low voltage well and a second low voltage well in a logic region of the substrate, and a memory array well in an NVM region of the substrate. A first layer of oxide is formed over the first low voltage well and the memory array well, and a second layer of oxide is formed over the second low voltage well, the second layer being thinner than the first layer. Gates are formed over the wells, including a first gate over the first low voltage well, a second gate over the second low voltage well, and a memory cell gate over the memory array well. Source/drain extension regions are formed around the gates.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INFORMATION STORAGE ; PHYSICS ; SEMICONDUCTOR DEVICES ; STATIC STORES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160524&DB=EPODOC&CC=US&NR=9349453B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160524&DB=EPODOC&CC=US&NR=9349453B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HONG CHEONG MIN</creatorcontrib><creatorcontrib>AKHTER TAHMINA</creatorcontrib><creatorcontrib>MULLER GILLES J</creatorcontrib><title>Semiconductor memory cell and driver circuitry with gate oxide formed simultaneously</title><description>The present disclosure provides for semiconductor structures and methods for making semiconductor structures. In one embodiment, isolation regions are formed in a substrate, and wells are formed between the isolation regions. The wells include a first low voltage well and a second low voltage well in a logic region of the substrate, and a memory array well in an NVM region of the substrate. A first layer of oxide is formed over the first low voltage well and the memory array well, and a second layer of oxide is formed over the second low voltage well, the second layer being thinner than the first layer. Gates are formed over the wells, including a first gate over the first low voltage well, a second gate over the second low voltage well, and a memory cell gate over the memory array well. Source/drain extension regions are formed around the gates.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INFORMATION STORAGE</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STATIC STORES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjsOwjAQRVE3FAjYw2yABociLSiIPqGOLPsFRrI9kT9Adg8FC6C6xblrNfQIbCW6aoskCgiSFrLwnkx05BI_kchyspXLV15cHnQ3BSRvdqBJUoCjzKH6YiKkZr9s1WoyPmP360bRpRvO1z1mGZFnYxFRxlvf6qZtjvp00H8sH5r-OY0</recordid><startdate>20160524</startdate><enddate>20160524</enddate><creator>HONG CHEONG MIN</creator><creator>AKHTER TAHMINA</creator><creator>MULLER GILLES J</creator><scope>EVB</scope></search><sort><creationdate>20160524</creationdate><title>Semiconductor memory cell and driver circuitry with gate oxide formed simultaneously</title><author>HONG CHEONG MIN ; AKHTER TAHMINA ; MULLER GILLES J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9349453B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INFORMATION STORAGE</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STATIC STORES</topic><toplevel>online_resources</toplevel><creatorcontrib>HONG CHEONG MIN</creatorcontrib><creatorcontrib>AKHTER TAHMINA</creatorcontrib><creatorcontrib>MULLER GILLES J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HONG CHEONG MIN</au><au>AKHTER TAHMINA</au><au>MULLER GILLES J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor memory cell and driver circuitry with gate oxide formed simultaneously</title><date>2016-05-24</date><risdate>2016</risdate><abstract>The present disclosure provides for semiconductor structures and methods for making semiconductor structures. In one embodiment, isolation regions are formed in a substrate, and wells are formed between the isolation regions. The wells include a first low voltage well and a second low voltage well in a logic region of the substrate, and a memory array well in an NVM region of the substrate. A first layer of oxide is formed over the first low voltage well and the memory array well, and a second layer of oxide is formed over the second low voltage well, the second layer being thinner than the first layer. Gates are formed over the wells, including a first gate over the first low voltage well, a second gate over the second low voltage well, and a memory cell gate over the memory array well. Source/drain extension regions are formed around the gates.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE PHYSICS SEMICONDUCTOR DEVICES STATIC STORES |
title | Semiconductor memory cell and driver circuitry with gate oxide formed simultaneously |
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