Bump structures for semiconductor package

A package structure includes a first substrate bonded to a second substrate by connecting metal pillars on the first substrate to connectors on the second substrate. A first metal pillar is formed overlying and electrically connected to a metal pad on a first region of the first substrate, and a sec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG CHENG-LIN, YU CHEN-HUA, LIN JINGNG, LIN MENG-LIANG, GAU JY-JIE, HSU KUOING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!