Frame and electronic device having the same

A frame to be assembled to a housing of an electronic device is provided. The frame includes a first material portion and a second material portion. The first material portion has a first thermal conductivity coefficient, and the second material portion has a second thermal conductivity coefficient....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIAO YU-JING, LIU HSINIH, LIN HUNG-WEN, CHUANG ING
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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