Hot melt adhesive based on low melting point polypropylene homopolymers
A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of ab...
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| creator | RACHOW LIANNE HAMANN RICHARD |
| description | A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50% of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi-crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.). |
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(325° F.).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | Hot melt adhesive based on low melting point polypropylene homopolymers |
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