Semiconductor package assembly with decoupling capacitor

A semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface. A second semiconductor package is bonded to the first devic...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSIEH TUNG-HSIEN, CHANG SHENG-MING, CHEN NANNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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