Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components
An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-th...
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| creator | PAI DEEPAK KESHAV GRAF MELVIN ERIC |
| description | An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead. |
| format | Patent |
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The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160419&DB=EPODOC&CC=US&NR=9318350B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160419&DB=EPODOC&CC=US&NR=9318350B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PAI DEEPAK KESHAV</creatorcontrib><creatorcontrib>GRAF MELVIN ERIC</creatorcontrib><title>Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components</title><description>An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKwjAURbs4iPoPb2yHgloEXS2Ki1RsnSW0L00wfQnJq1_jx1pFEJwcLvcOh3PH0eOIrGwDgoY4J7zgPoC0HmpLd_SsqR1m16HXtTBgpUxZYRoUGglxXlRlAqw0QeiEMant2WhCcKK-iRYhrsrilLwMzhISB9DEFnzfttj82s5v25edRiMpTMDZpycR7HdVfkjR2SuG4QMJ-XopN9lina3m22X2B_IEBY5RiQ</recordid><startdate>20160419</startdate><enddate>20160419</enddate><creator>PAI DEEPAK KESHAV</creator><creator>GRAF MELVIN ERIC</creator><scope>EVB</scope></search><sort><creationdate>20160419</creationdate><title>Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components</title><author>PAI DEEPAK KESHAV ; GRAF MELVIN ERIC</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9318350B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>PAI DEEPAK KESHAV</creatorcontrib><creatorcontrib>GRAF MELVIN ERIC</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PAI DEEPAK KESHAV</au><au>GRAF MELVIN ERIC</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components</title><date>2016-04-19</date><risdate>2016</risdate><abstract>An embodiment of the invention generally relates to a method of converting a commercial off-the-shelf electrical lead to a rugged off-the-shelf electrical lead by laser machining a portion of the electrical lead. The method includes ablating material from the electrical lead of the commercial off-the-shelf component to reduce the moment of inertia or increase the flexibility of the electrical lead.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Method and apparatus for converting commerical off-the-shelf (COTS) thin small-outline package (TSOP) components into rugged off-the-shelf (ROTS) components |
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