Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam

Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO2 laser), including at least one laser processing head (1), having interior (2) and nozzle (3) with nozzle orifice (4) for allowing a primary beam (5), in particular a focused laser w...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BEUTLER BEAT, RAUSCHENBACH SVEN, CATHRY DANIEL
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!