Microelectronic 3D packaging structure and method of manufacturing the same

A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and dispo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HSU LOUIS LUN, YANG LING-YUEH, CHAO PEN-SHAN, HORNG KUO-YANG, HU SHAOUNG, LIU WEIING, CHEN KUN-FENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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