Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip

In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output signal is dependent on at least one physical characteristic specific to the die; and a self-test circuit integrated with the physical unclo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAACKMANN PETER, JANKE MARCUS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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