Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip
In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output signal is dependent on at least one physical characteristic specific to the die; and a self-test circuit integrated with the physical unclo...
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| creator | LAACKMANN PETER JANKE MARCUS |
| description | In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output signal is dependent on at least one physical characteristic specific to the die; and a self-test circuit integrated with the physical unclonable function circuit on the die, wherein the self-test circuit is configured to provide at least one test input signal to the physical unclonable function circuit and to determine as to whether the output signal provided in response to the at least one test input signal fulfills a predefined criterion. |
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The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output signal is dependent on at least one physical characteristic specific to the die; and a self-test circuit integrated with the physical unclonable function circuit on the die, wherein the self-test circuit is configured to provide at least one test input signal to the physical unclonable function circuit and to determine as to whether the output signal provided in response to the at least one test input signal fulfills a predefined criterion.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160308&DB=EPODOC&CC=US&NR=9279856B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160308&DB=EPODOC&CC=US&NR=9279856B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LAACKMANN PETER</creatorcontrib><creatorcontrib>JANKE MARCUS</creatorcontrib><title>Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip</title><description>In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output signal is dependent on at least one physical characteristic specific to the die; and a self-test circuit integrated with the physical unclonable function circuit on the die, wherein the self-test circuit is configured to provide at least one test input signal to the physical unclonable function circuit and to determine as to whether the output signal provided in response to the at least one test input signal fulfills a predefined criterion.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhyyUzVUUjOyCzQUchNLcnIT1FIyy9SSCnKLMvMS1dIVEjJTFUACiSC1Sgk5qUgK8tNzCtNS0wuKS3CopiHgTUtMac4lRdKczMouLmGOHvophbkx6cWFyQmp-allsSHBlsamVtamJo5GRkToQQAdzI4mQ</recordid><startdate>20160308</startdate><enddate>20160308</enddate><creator>LAACKMANN PETER</creator><creator>JANKE MARCUS</creator><scope>EVB</scope></search><sort><creationdate>20160308</creationdate><title>Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip</title><author>LAACKMANN PETER ; JANKE MARCUS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9279856B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LAACKMANN PETER</creatorcontrib><creatorcontrib>JANKE MARCUS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LAACKMANN PETER</au><au>JANKE MARCUS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip</title><date>2016-03-08</date><risdate>2016</risdate><abstract>In various embodiments, a die is provided. The die may include a physical unclonable function circuit configured to provide an output signal, wherein the output signal is dependent on at least one physical characteristic specific to the die; and a self-test circuit integrated with the physical unclonable function circuit on the die, wherein the self-test circuit is configured to provide at least one test input signal to the physical unclonable function circuit and to determine as to whether the output signal provided in response to the at least one test input signal fulfills a predefined criterion.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | Die, chip, method for driving a die or a chip and method for manufacturing a die or a chip |
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