Optical wafer and die probe testing

An optical die probe wafer testing circuit arrangement and associated testing methodology are described for mounting a production test die (157) and surrounding scribe grid (156) to a test head (155) which is positioned over a wafer (160) in alignment with a die under test (163) and surrounding scri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MCSHANE MICHAEL B, PELLEY PERRY H, STEPHENS TAB A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES TESTING TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR
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