Optical wafer and die probe testing
An optical die probe wafer testing circuit arrangement and associated testing methodology are described for mounting a production test die (157) and surrounding scribe grid (156) to a test head (155) which is positioned over a wafer (160) in alignment with a die under test (163) and surrounding scri...
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| creator | MCSHANE MICHAEL B PELLEY PERRY H STEPHENS TAB A |
| description | An optical die probe wafer testing circuit arrangement and associated testing methodology are described for mounting a production test die (157) and surrounding scribe grid (156) to a test head (155) which is positioned over a wafer (160) in alignment with a die under test (163) and surrounding scribe grid (161, 165), such that one or more optical deflection mirrors (152, 154) in the test head scribe grid (156) are aligned with one or more optical deflection mirrors (162, 164) in the scribe grid (161, 165) for the die under test (163) to enable optical die probe testing on the die under test (163) by directing a first optical test signal (158) from the production test die (157), through the first and second optical deflection mirrors (e.g., 152, 162) and to the first die. |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS SEMICONDUCTOR DEVICES TESTING TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR |
| title | Optical wafer and die probe testing |
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