Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices

A semiconductor device has a conductive layer formed on a substrate. The conductive layer has a first portion constituting contact pads and a second portion constituting an integrated passive device such as an inductor. A spacer is formed on the substrate around the second portion of the conductive...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG RUI, KUAN HEAP HOE, LIN YAOJIAN, CHOW SENG GUAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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