Wafer die separation

A method of separating dice of a singulated wafer that is supported on a dicing tape sheet is disclosed. The method may include attaching the dicing tape sheet to a ring frame; relatively raising a portion of the dicing tape sheet supporting the wafer with respect to the ring frame; and attaching su...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YANO GENKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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