Apparatus and method for embedding components in small-form-factor, system-on-packages

According to various aspects of the present disclosure, devices and methods are disclosed that include communication platform including a small form factor platform having a system-on-package architecture. The system-on-package architecture may be arranged as a stack of layers including: a first layer of the stack of layers having a first conformable material; a second layer of the stack of layers having a second conformable material; a third layer of the stack of layers having a third material, wherein the first conformable material and the second conformable material are more flexible than the third material; and one or more electronic components embedded within the stack of layers, wherein the one or more electronic components are configured to process a received wireless signal.