Formation of a high aspect ratio contact hole
A small contact hole having a large aspect ratio is formed by employing a stop layer with a trench formed therein. A relatively large contact hole is formed above the trench, and the small contact hole is formed below the trench, using properties of the trench and the stop layer to limit the size of...
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creator | YANG ZUSING HSU FANG-HAO LEE HONG-JI |
description | A small contact hole having a large aspect ratio is formed by employing a stop layer with a trench formed therein. A relatively large contact hole is formed above the trench, and the small contact hole is formed below the trench, using properties of the trench and the stop layer to limit the size of the small contact hole. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9224803B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9224803B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9224803B23</originalsourceid><addsrcrecordid>eNrjZNB1yy_KTSzJzM9TyE9TSFTIyEzPUEgsLkhNLlEoAokrJOfnlSQCeRn5Oak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-NNjSyMjEwsDYyciYCCUARN4pdg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Formation of a high aspect ratio contact hole</title><source>esp@cenet</source><creator>YANG ZUSING ; HSU FANG-HAO ; LEE HONG-JI</creator><creatorcontrib>YANG ZUSING ; HSU FANG-HAO ; LEE HONG-JI</creatorcontrib><description>A small contact hole having a large aspect ratio is formed by employing a stop layer with a trench formed therein. A relatively large contact hole is formed above the trench, and the small contact hole is formed below the trench, using properties of the trench and the stop layer to limit the size of the small contact hole.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151229&DB=EPODOC&CC=US&NR=9224803B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151229&DB=EPODOC&CC=US&NR=9224803B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG ZUSING</creatorcontrib><creatorcontrib>HSU FANG-HAO</creatorcontrib><creatorcontrib>LEE HONG-JI</creatorcontrib><title>Formation of a high aspect ratio contact hole</title><description>A small contact hole having a large aspect ratio is formed by employing a stop layer with a trench formed therein. A relatively large contact hole is formed above the trench, and the small contact hole is formed below the trench, using properties of the trench and the stop layer to limit the size of the small contact hole.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB1yy_KTSzJzM9TyE9TSFTIyEzPUEgsLkhNLlEoAokrJOfnlSQCeRn5Oak8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSQ-NNjSyMjEwsDYyciYCCUARN4pdg</recordid><startdate>20151229</startdate><enddate>20151229</enddate><creator>YANG ZUSING</creator><creator>HSU FANG-HAO</creator><creator>LEE HONG-JI</creator><scope>EVB</scope></search><sort><creationdate>20151229</creationdate><title>Formation of a high aspect ratio contact hole</title><author>YANG ZUSING ; HSU FANG-HAO ; LEE HONG-JI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9224803B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG ZUSING</creatorcontrib><creatorcontrib>HSU FANG-HAO</creatorcontrib><creatorcontrib>LEE HONG-JI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG ZUSING</au><au>HSU FANG-HAO</au><au>LEE HONG-JI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Formation of a high aspect ratio contact hole</title><date>2015-12-29</date><risdate>2015</risdate><abstract>A small contact hole having a large aspect ratio is formed by employing a stop layer with a trench formed therein. A relatively large contact hole is formed above the trench, and the small contact hole is formed below the trench, using properties of the trench and the stop layer to limit the size of the small contact hole.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Formation of a high aspect ratio contact hole |
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