Aerogel dielectric layer

Aerogel dielectric layer

A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZAFIROPOULOS NICK, MILNE JASON G, CISCO TERRY C, GOULD GEORGE, NAHASS PAUL, HAUHE MARK S
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ZAFIROPOULOS NICK
MILNE JASON G
CISCO TERRY C
GOULD GEORGE
NAHASS PAUL
HAUHE MARK S
description A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9218989B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9218989B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9218989B23</originalsourceid><addsrcrecordid>eNrjZJBwTC3KT0_NUUjJTM1JTS4pykxWyEmsTC3iYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocGWRoYWlhaWTkbGRCgBALVfIiE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Aerogel dielectric layer</title><source>esp@cenet</source><creator>ZAFIROPOULOS NICK ; MILNE JASON G ; CISCO TERRY C ; GOULD GEORGE ; NAHASS PAUL ; HAUHE MARK S</creator><creatorcontrib>ZAFIROPOULOS NICK ; MILNE JASON G ; CISCO TERRY C ; GOULD GEORGE ; NAHASS PAUL ; HAUHE MARK S</creatorcontrib><description>A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151222&amp;DB=EPODOC&amp;CC=US&amp;NR=9218989B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151222&amp;DB=EPODOC&amp;CC=US&amp;NR=9218989B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZAFIROPOULOS NICK</creatorcontrib><creatorcontrib>MILNE JASON G</creatorcontrib><creatorcontrib>CISCO TERRY C</creatorcontrib><creatorcontrib>GOULD GEORGE</creatorcontrib><creatorcontrib>NAHASS PAUL</creatorcontrib><creatorcontrib>HAUHE MARK S</creatorcontrib><title>Aerogel dielectric layer</title><description>A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBwTC3KT0_NUUjJTM1JTS4pykxWyEmsTC3iYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxocGWRoYWlhaWTkbGRCgBALVfIiE</recordid><startdate>20151222</startdate><enddate>20151222</enddate><creator>ZAFIROPOULOS NICK</creator><creator>MILNE JASON G</creator><creator>CISCO TERRY C</creator><creator>GOULD GEORGE</creator><creator>NAHASS PAUL</creator><creator>HAUHE MARK S</creator><scope>EVB</scope></search><sort><creationdate>20151222</creationdate><title>Aerogel dielectric layer</title><author>ZAFIROPOULOS NICK ; MILNE JASON G ; CISCO TERRY C ; GOULD GEORGE ; NAHASS PAUL ; HAUHE MARK S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9218989B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZAFIROPOULOS NICK</creatorcontrib><creatorcontrib>MILNE JASON G</creatorcontrib><creatorcontrib>CISCO TERRY C</creatorcontrib><creatorcontrib>GOULD GEORGE</creatorcontrib><creatorcontrib>NAHASS PAUL</creatorcontrib><creatorcontrib>HAUHE MARK S</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZAFIROPOULOS NICK</au><au>MILNE JASON G</au><au>CISCO TERRY C</au><au>GOULD GEORGE</au><au>NAHASS PAUL</au><au>HAUHE MARK S</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Aerogel dielectric layer</title><date>2015-12-22</date><risdate>2015</risdate><abstract>A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US9218989B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Aerogel dielectric layer
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T17%3A38%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZAFIROPOULOS%20NICK&rft.date=2015-12-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9218989B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true