Stackable multi-chip package system

A stackable multi-chip package system is provided including forming an inter-chip structure adjacent to an external interconnect having both a base and a tip; connecting a first integrated circuit die and an outer portion of the base with the first integrated circuit die mounted over the inter-chip...

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Bibliographische Detailangaben

1. Verfasser:	YEE JAE HAK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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