Light emitting device package and light unit

Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wher...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM BYUNG MOK, MOON YON TAE, JUNG SU JUNG, CHO YOUNG JUN, HWANG SON KYO, KWON SEO YEON
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DEVICES USING STIMULATED EMISSION DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	KIM BYUNG MOK MOON YON TAE JUNG SU JUNG CHO YOUNG JUN HWANG SON KYO KWON SEO YEON
description	Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9196814B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9196814B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9196814B23</originalsourceid><addsrcrecordid>eNrjZNDxyUzPKFFIzc0sKcnMS1dISS3LTE5VKEhMzk5MT1VIzEtRyAGrKM3LLOFhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQE2peakl8aHBloaWZhaGJk5GxkQoAQApiylR</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting device package and light unit</title><source>esp@cenet</source><creator>KIM BYUNG MOK ; MOON YON TAE ; JUNG SU JUNG ; CHO YOUNG JUN ; HWANG SON KYO ; KWON SEO YEON</creator><creatorcontrib>KIM BYUNG MOK ; MOON YON TAE ; JUNG SU JUNG ; CHO YOUNG JUN ; HWANG SON KYO ; KWON SEO YEON</creatorcontrib><description>Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.</description><language>eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DEVICES USING STIMULATED EMISSION ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151124&DB=EPODOC&CC=US&NR=9196814B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151124&DB=EPODOC&CC=US&NR=9196814B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM BYUNG MOK</creatorcontrib><creatorcontrib>MOON YON TAE</creatorcontrib><creatorcontrib>JUNG SU JUNG</creatorcontrib><creatorcontrib>CHO YOUNG JUN</creatorcontrib><creatorcontrib>HWANG SON KYO</creatorcontrib><creatorcontrib>KWON SEO YEON</creatorcontrib><title>Light emitting device package and light unit</title><description>Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxyUzPKFFIzc0sKcnMS1dISS3LTE5VKEhMzk5MT1VIzEtRyAGrKM3LLOFhYE1LzClO5YXS3AwKbq4hzh66qQX58anFQE2peakl8aHBloaWZhaGJk5GxkQoAQApiylR</recordid><startdate>20151124</startdate><enddate>20151124</enddate><creator>KIM BYUNG MOK</creator><creator>MOON YON TAE</creator><creator>JUNG SU JUNG</creator><creator>CHO YOUNG JUN</creator><creator>HWANG SON KYO</creator><creator>KWON SEO YEON</creator><scope>EVB</scope></search><sort><creationdate>20151124</creationdate><title>Light emitting device package and light unit</title><author>KIM BYUNG MOK ; MOON YON TAE ; JUNG SU JUNG ; CHO YOUNG JUN ; HWANG SON KYO ; KWON SEO YEON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9196814B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM BYUNG MOK</creatorcontrib><creatorcontrib>MOON YON TAE</creatorcontrib><creatorcontrib>JUNG SU JUNG</creatorcontrib><creatorcontrib>CHO YOUNG JUN</creatorcontrib><creatorcontrib>HWANG SON KYO</creatorcontrib><creatorcontrib>KWON SEO YEON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM BYUNG MOK</au><au>MOON YON TAE</au><au>JUNG SU JUNG</au><au>CHO YOUNG JUN</au><au>HWANG SON KYO</au><au>KWON SEO YEON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting device package and light unit</title><date>2015-11-24</date><risdate>2015</risdate><abstract>Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US9196814B2
source	esp@cenet
subjects	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DEVICES USING STIMULATED EMISSION DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES SEMICONDUCTOR DEVICES
title	Light emitting device package and light unit
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T11%3A14%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIM%20BYUNG%20MOK&rft.date=2015-11-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9196814B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true