Cooling device for rack-type electronic equipment and data centre
The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electro...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | MATSUI MASAFUMI MATSUMOTO MUTSUHIKO SHIBATA HIROSHI HOSONO SHIGEYUKI |
description | The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electronic equipment. A condenser unit is provided on the upper surface of the enclosure, an evaporator is provided on the back surface of the enclosure, and each electronic circuit device having a different heating quantity is cooled by means of the heat pipes. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9192074B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9192074B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9192074B23</originalsourceid><addsrcrecordid>eNrjZHB0zs_PycxLV0hJLctMTlVIyy9SKEpMztYtqSxIVUjNSU0uKcrPy0xWSC0szSzITc0rUUjMS1FISSxJVEgG8opSeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBIlBZakl8aLCloaWRgbmJk5ExEUoAmi4xWg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Cooling device for rack-type electronic equipment and data centre</title><source>esp@cenet</source><creator>MATSUI MASAFUMI ; MATSUMOTO MUTSUHIKO ; SHIBATA HIROSHI ; HOSONO SHIGEYUKI</creator><creatorcontrib>MATSUI MASAFUMI ; MATSUMOTO MUTSUHIKO ; SHIBATA HIROSHI ; HOSONO SHIGEYUKI</creatorcontrib><description>The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electronic equipment. A condenser unit is provided on the upper surface of the enclosure, an evaporator is provided on the back surface of the enclosure, and each electronic circuit device having a different heating quantity is cooled by means of the heat pipes.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151117&DB=EPODOC&CC=US&NR=9192074B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151117&DB=EPODOC&CC=US&NR=9192074B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUI MASAFUMI</creatorcontrib><creatorcontrib>MATSUMOTO MUTSUHIKO</creatorcontrib><creatorcontrib>SHIBATA HIROSHI</creatorcontrib><creatorcontrib>HOSONO SHIGEYUKI</creatorcontrib><title>Cooling device for rack-type electronic equipment and data centre</title><description>The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electronic equipment. A condenser unit is provided on the upper surface of the enclosure, an evaporator is provided on the back surface of the enclosure, and each electronic circuit device having a different heating quantity is cooled by means of the heat pipes.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB0zs_PycxLV0hJLctMTlVIyy9SKEpMztYtqSxIVUjNSU0uKcrPy0xWSC0szSzITc0rUUjMS1FISSxJVEgG8opSeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBIlBZakl8aLCloaWRgbmJk5ExEUoAmi4xWg</recordid><startdate>20151117</startdate><enddate>20151117</enddate><creator>MATSUI MASAFUMI</creator><creator>MATSUMOTO MUTSUHIKO</creator><creator>SHIBATA HIROSHI</creator><creator>HOSONO SHIGEYUKI</creator><scope>EVB</scope></search><sort><creationdate>20151117</creationdate><title>Cooling device for rack-type electronic equipment and data centre</title><author>MATSUI MASAFUMI ; MATSUMOTO MUTSUHIKO ; SHIBATA HIROSHI ; HOSONO SHIGEYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9192074B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUI MASAFUMI</creatorcontrib><creatorcontrib>MATSUMOTO MUTSUHIKO</creatorcontrib><creatorcontrib>SHIBATA HIROSHI</creatorcontrib><creatorcontrib>HOSONO SHIGEYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUI MASAFUMI</au><au>MATSUMOTO MUTSUHIKO</au><au>SHIBATA HIROSHI</au><au>HOSONO SHIGEYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cooling device for rack-type electronic equipment and data centre</title><date>2015-11-17</date><risdate>2015</risdate><abstract>The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electronic equipment. A condenser unit is provided on the upper surface of the enclosure, an evaporator is provided on the back surface of the enclosure, and each electronic circuit device having a different heating quantity is cooled by means of the heat pipes.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US9192074B2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | Cooling device for rack-type electronic equipment and data centre |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T13%3A35%3A50IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MATSUI%20MASAFUMI&rft.date=2015-11-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9192074B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |