Method for manufacturing semiconductor package

Method for manufacturing semiconductor package

Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semicond...

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Hauptverfasser: KWON HYUN BOK, WOO SEUNG WAN, HWANG YOUNG NAM, SHIN YEE NA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KWON HYUN BOK
WOO SEUNG WAN
HWANG YOUNG NAM
SHIN YEE NA
description Disclosed herein is a method for manufacturing a semiconductor package. According to a preferred embodiment of the present invention, a method for manufacturing a semiconductor package includes: preparing a rectangular frame having a plurality of quadrangular holes; attaching a plurality of semiconductor chips and the frame on one surface of a tape; forming a molding part on the tape to cover the semiconductor chip and the frame; peeling the tape; forming a resin layer at a portion at which the tape is peeled; and forming a wiring on the resin layer to be connected to the semiconductor chip.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for manufacturing semiconductor package
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