Electrical connectivity for circuit applications

According to example configurations herein, a leadframe includes a first conductive strip, a second conductive strip, and a third conductive strip disposed substantially adjacent and substantially parallel to each other. A semiconductor chip substrate includes a first array of switch circuits dispos...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DESBIENS DONALD J, CARROLL ROBERT T, POLHEMUS GARY D
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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