Electrolytic copper plating liquid and the electrolytic copper plating method

Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of -X-S-Y- where X and Y are each an atom se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SAKAI MAKOTO, SAITO MUTSUKO, MIZUNO YOKO, HAYASHI SHINJIRO, MORINAGA TOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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