Focal plane array packaging using isostatic pressure processing

A method for bonding a first semiconductor body having a plurality of electromagnetic radiation detectors to a second semiconductor body having read out integrated circuits for the detectors. The method includes: aligning electrical contacts for the plurality of electromagnetic radiation detectors w...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GERBER KENNETH ALLEN, RAMIREZ AARON M, GETTY JONATHAN, MILLER SCOTT S
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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