Optoelectronic package and method for making same

Optoelectronic package and method for making same

An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and...

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Hauptverfasser: LIN DANNY CHIH HSUN, HUNG VINCENT WAI, TONG DENNIS TAK KIT, GAMBOA FRANCIS GUILLEN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIN DANNY CHIH HSUN
HUNG VINCENT WAI
TONG DENNIS TAK KIT
GAMBOA FRANCIS GUILLEN
description An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Optoelectronic package and method for making same
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