Packaging structural member

A structural member for use in semiconductor packaging is disclosed. The structural member includes a plurality of packaging regions to facilitate packaging dies in, for example, a wafer format. A packaging region has a die attach region surrounded by a peripheral region. A die is attached to the di...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOH CHIN HOCK, SUN YI SHENG ANTHONY, ZHANG XUE REN, KOLAN RAVI KANTH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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