Semiconductor package stack having a heat slug

A semiconductor package stack may include a lower semiconductor package and an upper semiconductor package stacked on a lower package board. The upper semiconductor package may include an upper semiconductor chip mounted on an upper package board with an opening configured to expose a lower surface...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM YONG-HOON, KIM JIUL, CHOI IN-HO, SHIN SEONG-HO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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