Stacked type power device module

The disclosure relates to a stacked type power device module. May use the vertical conductive layer for coupling the stacked devices, the electrical transmission path may be shortened. Hence, current crowding or contact damages by employing the conductive vias or wire bonding may be alleviated.

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Hauptverfasser:	CHANG TAOIH, HUNG YIN-PO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	CHANG TAOIH HUNG YIN-PO
description	The disclosure relates to a stacked type power device module. May use the vertical conductive layer for coupling the stacked devices, the electrical transmission path may be shortened. Hence, current crowding or contact damages by employing the conductive vias or wire bonding may be alleviated.
format	Patent
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	Stacked type power device module
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