Coated lead frame bond finger

A lead frame includes a lead formed of a conductive material and having first and second ends, opposing first and second main surfaces, and opposing first and second side surfaces each extending between the first and second main surfaces. A polymeric layer is formed at least on the first main surfac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TENG SENG KIONG, KOH WEN SHI, KHOO LY HOON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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