Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a w...

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Hauptverfasser: NG HONG WAN, CHAI DAVID YIH MING, LEE TECK KHENG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator NG HONG WAN
CHAI DAVID YIH MING
LEE TECK KHENG
description Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9129862B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9129862B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9129862B23</originalsourceid><addsrcrecordid>eNrjZEjyzUwuyk_NSU0uKcrPy0xWSEkty0xOLVZIzEtRyEWTKy4tKMgvKoGp0QErSiwuzk_OTCxJBTNTc5NyMmHaU0sy8lOKeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwpaGRpYWZkZORMRFKAFSfPq0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Microelectronic devices and microelectronic support devices, and associated assemblies and methods</title><source>esp@cenet</source><creator>NG HONG WAN ; CHAI DAVID YIH MING ; LEE TECK KHENG</creator><creatorcontrib>NG HONG WAN ; CHAI DAVID YIH MING ; LEE TECK KHENG</creatorcontrib><description>Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150908&amp;DB=EPODOC&amp;CC=US&amp;NR=9129862B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150908&amp;DB=EPODOC&amp;CC=US&amp;NR=9129862B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NG HONG WAN</creatorcontrib><creatorcontrib>CHAI DAVID YIH MING</creatorcontrib><creatorcontrib>LEE TECK KHENG</creatorcontrib><title>Microelectronic devices and microelectronic support devices, and associated assemblies and methods</title><description>Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEjyzUwuyk_NSU0uKcrPy0xWSEkty0xOLVZIzEtRyEWTKy4tKMgvKoGp0QErSiwuzk_OTCxJBTNTc5NyMmHaU0sy8lOKeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwpaGRpYWZkZORMRFKAFSfPq0</recordid><startdate>20150908</startdate><enddate>20150908</enddate><creator>NG HONG WAN</creator><creator>CHAI DAVID YIH MING</creator><creator>LEE TECK KHENG</creator><scope>EVB</scope></search><sort><creationdate>20150908</creationdate><title>Microelectronic devices and microelectronic support devices, and associated assemblies and methods</title><author>NG HONG WAN ; CHAI DAVID YIH MING ; LEE TECK KHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9129862B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NG HONG WAN</creatorcontrib><creatorcontrib>CHAI DAVID YIH MING</creatorcontrib><creatorcontrib>LEE TECK KHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NG HONG WAN</au><au>CHAI DAVID YIH MING</au><au>LEE TECK KHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Microelectronic devices and microelectronic support devices, and associated assemblies and methods</title><date>2015-09-08</date><risdate>2015</risdate><abstract>Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Microelectronic devices and microelectronic support devices, and associated assemblies and methods
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T19%3A35%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NG%20HONG%20WAN&rft.date=2015-09-08&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9129862B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true