Apparatus and method for forming alignment features for back side processing of a wafer

A method for forming an alignment feature for back side wafer processing in a wafer fabrication process involves forming a trench into but not entirely through a wafer from a top side of the wafer; forming a contrasting material on surfaces of the trench; and grinding a bottom side of the wafer to e...

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Bibliographische Detailangaben

Hauptverfasser:	TSAU CHRISTINE H, SAWYER WILLIAM DAVID, NUNAN THOMAS KIERAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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