Controlled fluid delivery in a microelectronic package
A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel...
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| creator | SUPRIYA LAKSHMI CHAKRAPANI NIRUPAMA MATAYABAS, JR. JAMES C |
| description | A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths. |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPRAYING OR ATOMISING IN GENERAL THEIR RELEVANT APPARATUS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Controlled fluid delivery in a microelectronic package |
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