Methods for controlling warpage in packaging

A method includes placing a plurality of dummy dies over a carrier, placing a plurality of device dies over the carrier, molding the plurality of dummy dies and the plurality of device dies in a molding compound, forming redistribution line over and electrically coupled to the device dies, and perfo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JANG BOR-PING, LIANG HSIAOUNG, LIAO HSIN-HUNG, LIU CHUNG-SHI, LIN YEONG-JYH, HWANG CHIEN LING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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