Semiconductor device with stacked semiconductor chips

A semiconductor device includes first to third semiconductor chips. The second semiconductor chip is stacked over the first semiconductor chip. The third semiconductor chip is stacked over the second semiconductor chip. The second semiconductor chip shields the first semiconductor chip from noises g...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	USAMI TOSHIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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