Apparatus and method for generating separating fissures in a substrate

The invention is directed to an apparatus and a method for generating separating fissures in a substrate through action of a laser beam having an elliptical beam cross section with a beam spot length in a movement direction along a separating fissure to be generated in the substrate. The apparatus a...

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Bibliographische Detailangaben
Hauptverfasser:	ULLMANN RONNY, WEISSER JUERGEN, MATTHIES CHRISTIAN, HEINIG KARSTEN, NAWRODT SEBASTIAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention is directed to an apparatus and a method for generating separating fissures in a substrate through action of a laser beam having an elliptical beam cross section with a beam spot length in a movement direction along a separating fissure to be generated in the substrate. The apparatus and method are particularly suitable for separating fissures which start or end on the substrate surface. A suitable diaphragm prevents radiation from impinging on the substrate before the start and after the end of the fissure.