Assembly structure for injection molded substrate and for mounting component

Assembly structure for injection molded substrate and for mounting component

A substrate (1) includes conductive portions (7) formed by press working and a resin portion (11) integrally injection-molded with the conductive portions (7). The conductive portions (7) are formed from, for example, a copper alloy. The resin portion 11 is formed from, for example, PPS. A surface-m...

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Hauptverfasser: HARA TOSHITAKA, TORATANI TOMOAKI, SHIBAMURA MOTOMU, ABE KYUTARO, HASHIMOTO KYOSUKE
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator HARA TOSHITAKA
TORATANI TOMOAKI
SHIBAMURA MOTOMU
ABE KYUTARO
HASHIMOTO KYOSUKE
description A substrate (1) includes conductive portions (7) formed by press working and a resin portion (11) integrally injection-molded with the conductive portions (7). The conductive portions (7) are formed from, for example, a copper alloy. The resin portion 11 is formed from, for example, PPS. A surface-mount component (3), which is an electronic surface-mount component, is mounted on the substrate (1). The surface-mount component (3) has electrodes (5) at its opposite sides, and the electrodes (5) and the respective conductive portions (7) are electrically connected by means of a solder (9). The substrate (1) has a hole (13), which functions as a stress relaxation mechanism, formed in the resin portion (11) (a portion extending therethrough) between connection portions (15) under the surface-mount component (3). The substrate (1) also has resin-exposed portions (13), which function as a stress relaxation mechanism, formed on opposite sides of the surface-mount component (3).
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Assembly structure for injection molded substrate and for mounting component
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