Heated cooling plate for E-chucks and pedestals

Heated cooling plate for E-chucks and pedestals

A method and apparatus for controlling the temperature of a substrate support assembly includes a pedestal, a chuck connected to the pedestal, a cooling plate structure thermally coupled with the chuck, a heater thermally coupled with the cooling plate structure, and a controller configured to contr...

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Hauptverfasser: ROY SHAMBHU N, TSAI MATT CHENG-HSIUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator ROY SHAMBHU N
TSAI MATT CHENG-HSIUNG
description A method and apparatus for controlling the temperature of a substrate support assembly includes a pedestal, a chuck connected to the pedestal, a cooling plate structure thermally coupled with the chuck, a heater thermally coupled with the cooling plate structure, and a controller configured to control the cooling plate structure while controlling the heater during processing of a substrate on the chuck. The method includes cooling a substrate support with a cooling plate structure while heating the cooling plate structure with a heater thermally coupled with the cooling plate structure, monitoring the performance of the cooling plate structure and the heater, and regulating the performance of the cooling plate structure and the heater to maintain the substrate support at a desired temperature.
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The method includes cooling a substrate support with a cooling plate structure while heating the cooling plate structure with a heater thermally coupled with the cooling plate structure, monitoring the performance of the cooling plate structure and the heater, and regulating the performance of the cooling plate structure and the heater to maintain the substrate support at a desired temperature.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150623&amp;DB=EPODOC&amp;CC=US&amp;NR=9064911B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20150623&amp;DB=EPODOC&amp;CC=US&amp;NR=9064911B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ROY SHAMBHU N</creatorcontrib><creatorcontrib>TSAI MATT CHENG-HSIUNG</creatorcontrib><title>Heated cooling plate for E-chucks and pedestals</title><description>A method and apparatus for controlling the temperature of a substrate support assembly includes a pedestal, a chuck connected to the pedestal, a cooling plate structure thermally coupled with the chuck, a heater thermally coupled with the cooling plate structure, and a controller configured to control the cooling plate structure while controlling the heater during processing of a substrate on the chuck. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Heated cooling plate for E-chucks and pedestals
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