Method of forming an erbium silicide metal gate stack FinFET device via a physical vapor deposition nanolaminate approach

Method of forming an erbium silicide metal gate stack FinFET device via a physical vapor deposition nanolaminate approach

Methods to form metal gate transistor devices are disclosed. Erbium silicide layers can be used in CMOS transistors in which the work function of the erbium silicide layers can be tuned for use in PMOS and NMOS devices. A nanolaminate sputtering approach can be used in which silicon and erbium layer...

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Hauptverfasser: KARLSSON OLOV, HONG ZHENDONG, BODKE ASHISH
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Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KARLSSON OLOV
HONG ZHENDONG
BODKE ASHISH
description Methods to form metal gate transistor devices are disclosed. Erbium silicide layers can be used in CMOS transistors in which the work function of the erbium silicide layers can be tuned for use in PMOS and NMOS devices. A nanolaminate sputtering approach can be used in which silicon and erbium layers are alternatingly deposited to determine optimum layer properties, composition profiles, and erbium to silicon ratios for a particular gate stack.
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ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method of forming an erbium silicide metal gate stack FinFET device via a physical vapor deposition nanolaminate approach
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