Substrate firing device
A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and contracts due to heating and cooling. By increasing the contact...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | JUNG WON-WOONG SHIN HYUNUL |
| description | A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and contracts due to heating and cooling. By increasing the contact area to the substrate and by using quartz on items that contact the substrate, it is possible to prevent scratches occurring on a substrate, even after an etching process of the substrate, thereby improving quality of the slimmer final product. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US9052145B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US9052145B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US9052145B23</originalsourceid><addsrcrecordid>eNrjZBAPLk0qLilKLElVSMssysxLV0hJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwZYGpkaGJqZORsZEKAEAk94hsA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate firing device</title><source>esp@cenet</source><creator>JUNG WON-WOONG ; SHIN HYUNUL</creator><creatorcontrib>JUNG WON-WOONG ; SHIN HYUNUL</creatorcontrib><description>A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and contracts due to heating and cooling. By increasing the contact area to the substrate and by using quartz on items that contact the substrate, it is possible to prevent scratches occurring on a substrate, even after an etching process of the substrate, thereby improving quality of the slimmer final product.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FURNACES ; FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL ; HEATING ; KILNS ; LIGHTING ; MECHANICAL ENGINEERING ; OPEN SINTERING OR LIKE APPARATUS ; OVENS ; RETORTS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150609&DB=EPODOC&CC=US&NR=9052145B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150609&DB=EPODOC&CC=US&NR=9052145B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JUNG WON-WOONG</creatorcontrib><creatorcontrib>SHIN HYUNUL</creatorcontrib><title>Substrate firing device</title><description>A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and contracts due to heating and cooling. By increasing the contact area to the substrate and by using quartz on items that contact the substrate, it is possible to prevent scratches occurring on a substrate, even after an etching process of the substrate, thereby improving quality of the slimmer final product.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FURNACES</subject><subject>FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL</subject><subject>HEATING</subject><subject>KILNS</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>OPEN SINTERING OR LIKE APPARATUS</subject><subject>OVENS</subject><subject>RETORTS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAPLk0qLilKLElVSMssysxLV0hJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwZYGpkaGJqZORsZEKAEAk94hsA</recordid><startdate>20150609</startdate><enddate>20150609</enddate><creator>JUNG WON-WOONG</creator><creator>SHIN HYUNUL</creator><scope>EVB</scope></search><sort><creationdate>20150609</creationdate><title>Substrate firing device</title><author>JUNG WON-WOONG ; SHIN HYUNUL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US9052145B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FURNACES</topic><topic>FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL</topic><topic>HEATING</topic><topic>KILNS</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>OPEN SINTERING OR LIKE APPARATUS</topic><topic>OVENS</topic><topic>RETORTS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>JUNG WON-WOONG</creatorcontrib><creatorcontrib>SHIN HYUNUL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JUNG WON-WOONG</au><au>SHIN HYUNUL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate firing device</title><date>2015-06-09</date><risdate>2015</risdate><abstract>A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and contracts due to heating and cooling. By increasing the contact area to the substrate and by using quartz on items that contact the substrate, it is possible to prevent scratches occurring on a substrate, even after an etching process of the substrate, thereby improving quality of the slimmer final product.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US9052145B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS BLASTING DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FURNACES FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL HEATING KILNS LIGHTING MECHANICAL ENGINEERING OPEN SINTERING OR LIKE APPARATUS OVENS RETORTS SEMICONDUCTOR DEVICES WEAPONS |
| title | Substrate firing device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T08%3A16%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JUNG%20WON-WOONG&rft.date=2015-06-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS9052145B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |