Semiconductor device and method of fabricating the same

A semiconductor device includes: a mount body; a semiconductor chip mounted on the mount body via projecting connecting terminals; and a filling resin filled between the mount body and the semiconductor chip to seal the connecting terminals, the filling resin being retained inside the semiconductor...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HARADA YOSHIMICHI, MURAI MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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