Integrated circuit packaging system with a flip chip and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system includes: providing a lead; placing an integrated circuit device, having an external connector, adjacent to and electrically isolated from the lead; mounting an integrated circuit over the lead and the integrated circuit device with t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BATHAN HENRY DESCALZO, CAMACHO ZIGMUND RAMIREZ, PISIGAN JAIRUS LEGASPI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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