GST film thickness monitoring
In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequenc...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LIU FENG SWEDEK BOGUSLAW A WANG YUCHUN BENVEGNU DOMINIC J TU WENIANG KARUPPIAH LAKSH XU KUN |
| description | In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8989890B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8989890B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8989890B23</originalsourceid><addsrcrecordid>eNrjZJB1Dw5RSMvMyVUoychMzs5LLS5WyM3PyyzJL8rMS-dhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwRaWIGjgZGRMhBIAgfQkBA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GST film thickness monitoring</title><source>esp@cenet</source><creator>LIU FENG ; SWEDEK BOGUSLAW A ; WANG YUCHUN ; BENVEGNU DOMINIC J ; TU WENIANG ; KARUPPIAH LAKSH ; XU KUN</creator><creatorcontrib>LIU FENG ; SWEDEK BOGUSLAW A ; WANG YUCHUN ; BENVEGNU DOMINIC J ; TU WENIANG ; KARUPPIAH LAKSH ; XU KUN</creatorcontrib><description>In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CALCULATING ; CHEMISTRY ; COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F ; COMPUTING ; COUNTING ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ENGINE PLANTS IN GENERAL ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; HEATING ; INORGANIC CHEMISTRY ; LIGHTING ; MACHINES OR ENGINES IN GENERAL ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; MECHANICAL ENGINEERING ; METALLURGY ; NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES ; NON-POSITIVE DISPLACEMENT PUMPS ; PERFORMING OPERATIONS ; PHYSICS ; POLISHING ; POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS ; PUMPS ; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS ; SEMICONDUCTOR DEVICES ; STEAM ENGINES ; TESTING ; TRANSPORTING ; WEAPONS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150324&DB=EPODOC&CC=US&NR=8989890B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150324&DB=EPODOC&CC=US&NR=8989890B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU FENG</creatorcontrib><creatorcontrib>SWEDEK BOGUSLAW A</creatorcontrib><creatorcontrib>WANG YUCHUN</creatorcontrib><creatorcontrib>BENVEGNU DOMINIC J</creatorcontrib><creatorcontrib>TU WENIANG</creatorcontrib><creatorcontrib>KARUPPIAH LAKSH</creatorcontrib><creatorcontrib>XU KUN</creatorcontrib><title>GST film thickness monitoring</title><description>In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CALCULATING</subject><subject>CHEMISTRY</subject><subject>COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ENGINE PLANTS IN GENERAL</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>HEATING</subject><subject>INORGANIC CHEMISTRY</subject><subject>LIGHTING</subject><subject>MACHINES OR ENGINES IN GENERAL</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>MECHANICAL ENGINEERING</subject><subject>METALLURGY</subject><subject>NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES</subject><subject>NON-POSITIVE DISPLACEMENT PUMPS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>POLISHING</subject><subject>POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS</subject><subject>PUMPS</subject><subject>PUMPS FOR LIQUIDS OR ELASTIC FLUIDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>STEAM ENGINES</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB1Dw5RSMvMyVUoychMzs5LLS5WyM3PyyzJL8rMS-dhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGhwRaWIGjgZGRMhBIAgfQkBA</recordid><startdate>20150324</startdate><enddate>20150324</enddate><creator>LIU FENG</creator><creator>SWEDEK BOGUSLAW A</creator><creator>WANG YUCHUN</creator><creator>BENVEGNU DOMINIC J</creator><creator>TU WENIANG</creator><creator>KARUPPIAH LAKSH</creator><creator>XU KUN</creator><scope>EVB</scope></search><sort><creationdate>20150324</creationdate><title>GST film thickness monitoring</title><author>LIU FENG ; SWEDEK BOGUSLAW A ; WANG YUCHUN ; BENVEGNU DOMINIC J ; TU WENIANG ; KARUPPIAH LAKSH ; XU KUN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8989890B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CALCULATING</topic><topic>CHEMISTRY</topic><topic>COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ENGINE PLANTS IN GENERAL</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>HEATING</topic><topic>INORGANIC CHEMISTRY</topic><topic>LIGHTING</topic><topic>MACHINES OR ENGINES IN GENERAL</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>MECHANICAL ENGINEERING</topic><topic>METALLURGY</topic><topic>NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES</topic><topic>NON-POSITIVE DISPLACEMENT PUMPS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>POLISHING</topic><topic>POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS</topic><topic>PUMPS</topic><topic>PUMPS FOR LIQUIDS OR ELASTIC FLUIDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>STEAM ENGINES</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU FENG</creatorcontrib><creatorcontrib>SWEDEK BOGUSLAW A</creatorcontrib><creatorcontrib>WANG YUCHUN</creatorcontrib><creatorcontrib>BENVEGNU DOMINIC J</creatorcontrib><creatorcontrib>TU WENIANG</creatorcontrib><creatorcontrib>KARUPPIAH LAKSH</creatorcontrib><creatorcontrib>XU KUN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU FENG</au><au>SWEDEK BOGUSLAW A</au><au>WANG YUCHUN</au><au>BENVEGNU DOMINIC J</au><au>TU WENIANG</au><au>KARUPPIAH LAKSH</au><au>XU KUN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GST film thickness monitoring</title><date>2015-03-24</date><risdate>2015</risdate><abstract>In polishing a substrate having a layer of GST disposed over an underlying layer, during polishing, a non-polarized light beam is directed onto the layer of GST. The non-polarized light beam reflects from the first substrate to generate a reflected light beam having an infra-red component. A sequence of measurements of intensity of the infra-red component of the reflected light beam are generated, and, in a processor, a time at which the sequence of measurements exhibits a predefined feature is determined.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US8989890B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS BLASTING CALCULATING CHEMISTRY COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSESC01D OR C01F COMPUTING COUNTING DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINE PLANTS IN GENERAL FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING HEATING INORGANIC CHEMISTRY LIGHTING MACHINES OR ENGINES IN GENERAL MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MECHANICAL ENGINEERING METALLURGY NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAMTURBINES NON-POSITIVE DISPLACEMENT PUMPS PERFORMING OPERATIONS PHYSICS POLISHING POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS SEMICONDUCTOR DEVICES STEAM ENGINES TESTING TRANSPORTING WEAPONS |
| title | GST film thickness monitoring |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T21%3A07%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIU%20FENG&rft.date=2015-03-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8989890B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |