Method of testing a semiconductor package

A method of testing a semiconductor package is provided, including: disposing at least an interposer on a top surface of an adhesive layer, the interposer having a first surface and a second surface opposite to the first surface, a plurality of conductive elements disposed between the second surface...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSENG WEN-TSUNG, LAI YI, LIN CHUN-TANG, HUANG PINNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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