Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method

A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is bonded, and a bonding layer formed on the adhesive layer and having a central portion to which a semico...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FURUTANI RYOJI, KATOU SHINYA, KOMORIDA KOUJI, KATOU RIE, SAKUTA TATSUYA, MATSUZAKI TAKAYUKI
Format: Patent
Sprache:eng
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