Track processing to remove organic films in directed self-assembly chemo-epitaxy applications

A method is provided for preparing a prepatterned substrate for use in DSA integration. In one example, the method includes removing a radiation-sensitive material pattern overlying a patterned cross-linked polystyrene copolymer layer by a) exposure to a solvent vapor, b) exposure to a liquid solven...

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Bibliographische Detailangaben
Hauptverfasser: HETZER DAVID, HULI LIOR, SOMERVELL MARK H
Format: Patent
Sprache:eng
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