Thermal compression bonding of semiconductor chips
A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substr...
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| creator | MAK YICK HONG LO TSAN YIN PETER LI MING CHEUNG YIU MING LAM KA SAN |
| description | A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US8967452B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US8967452B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US8967452B23</originalsourceid><addsrcrecordid>eNrjZDAKyUgtyk3MUUjOzy0oSi0uzszPU0jKz0vJzEtXyE9TKE7NzUwGckuTS_KLFJIzMguKeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwhaWZuYmpkZORMRFKALDJLGg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermal compression bonding of semiconductor chips</title><source>esp@cenet</source><creator>MAK YICK HONG ; LO TSAN YIN PETER ; LI MING ; CHEUNG YIU MING ; LAM KA SAN</creator><creatorcontrib>MAK YICK HONG ; LO TSAN YIN PETER ; LI MING ; CHEUNG YIU MING ; LAM KA SAN</creatorcontrib><description>A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.</description><language>eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150303&DB=EPODOC&CC=US&NR=8967452B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150303&DB=EPODOC&CC=US&NR=8967452B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MAK YICK HONG</creatorcontrib><creatorcontrib>LO TSAN YIN PETER</creatorcontrib><creatorcontrib>LI MING</creatorcontrib><creatorcontrib>CHEUNG YIU MING</creatorcontrib><creatorcontrib>LAM KA SAN</creatorcontrib><title>Thermal compression bonding of semiconductor chips</title><description>A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKyUgtyk3MUUjOzy0oSi0uzszPU0jKz0vJzEtXyE9TKE7NzUwGckuTS_KLFJIzMguKeRhY0xJzilN5oTQ3g4Kba4izh25qQX58anFBYnJqXmpJfGiwhaWZuYmpkZORMRFKALDJLGg</recordid><startdate>20150303</startdate><enddate>20150303</enddate><creator>MAK YICK HONG</creator><creator>LO TSAN YIN PETER</creator><creator>LI MING</creator><creator>CHEUNG YIU MING</creator><creator>LAM KA SAN</creator><scope>EVB</scope></search><sort><creationdate>20150303</creationdate><title>Thermal compression bonding of semiconductor chips</title><author>MAK YICK HONG ; LO TSAN YIN PETER ; LI MING ; CHEUNG YIU MING ; LAM KA SAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8967452B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MAK YICK HONG</creatorcontrib><creatorcontrib>LO TSAN YIN PETER</creatorcontrib><creatorcontrib>LI MING</creatorcontrib><creatorcontrib>CHEUNG YIU MING</creatorcontrib><creatorcontrib>LAM KA SAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MAK YICK HONG</au><au>LO TSAN YIN PETER</au><au>LI MING</au><au>CHEUNG YIU MING</au><au>LAM KA SAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermal compression bonding of semiconductor chips</title><date>2015-03-03</date><risdate>2015</risdate><abstract>A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Thermal compression bonding of semiconductor chips |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T00%3A48%3A15IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MAK%20YICK%20HONG&rft.date=2015-03-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS8967452B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |