Contact portion of wire and manufacturing method thereof

A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a m...

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Hauptverfasser: SONG KI-YONG, YOON YEO-GEON, PARK JI-YOUNG, KIM JAE-HONG, JEONG YU-GWANG, YANG DONG-JU, KIM HEE-JOON, LEE KI-YEUP, CHOI SHIN-IL, YEO YUN-JONG, KIM SANG-GAB, KIM CHANG-HOON, CHO SUNG-HEN, KIM JOO-HAN
Format: Patent
Sprache:eng
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