Contact portion of wire and manufacturing method thereof
A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a m...
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| creator | SONG KI-YONG YOON YEO-GEON PARK JI-YOUNG KIM JAE-HONG JEONG YU-GWANG YANG DONG-JU KIM HEE-JOON LEE KI-YEUP CHOI SHIN-IL YEO YUN-JONG KIM SANG-GAB KIM CHANG-HOON CHO SUNG-HEN KIM JOO-HAN |
| description | A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut. |
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A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FREQUENCY-CHANGING ; NON-LINEAR OPTICS ; OPTICAL ANALOGUE/DIGITAL CONVERTERS ; OPTICAL LOGIC ELEMENTS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES ; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150203&DB=EPODOC&CC=US&NR=8946004B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150203&DB=EPODOC&CC=US&NR=8946004B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG KI-YONG</creatorcontrib><creatorcontrib>YOON YEO-GEON</creatorcontrib><creatorcontrib>PARK JI-YOUNG</creatorcontrib><creatorcontrib>KIM JAE-HONG</creatorcontrib><creatorcontrib>JEONG YU-GWANG</creatorcontrib><creatorcontrib>YANG DONG-JU</creatorcontrib><creatorcontrib>KIM HEE-JOON</creatorcontrib><creatorcontrib>LEE KI-YEUP</creatorcontrib><creatorcontrib>CHOI SHIN-IL</creatorcontrib><creatorcontrib>YEO YUN-JONG</creatorcontrib><creatorcontrib>KIM SANG-GAB</creatorcontrib><creatorcontrib>KIM CHANG-HOON</creatorcontrib><creatorcontrib>CHO SUNG-HEN</creatorcontrib><creatorcontrib>KIM JOO-HAN</creatorcontrib><title>Contact portion of wire and manufacturing method thereof</title><description>A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FREQUENCY-CHANGING</subject><subject>NON-LINEAR OPTICS</subject><subject>OPTICAL ANALOGUE/DIGITAL CONVERTERS</subject><subject>OPTICAL LOGIC ELEMENTS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBwzs8rSUwuUSjILyrJzM9TyE9TKM8sSlVIzEtRyE3MK00DSpYWZealK-SmlmTkpyiUZKQWpean8TCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSS-NBgC0sTMwMDEycjYyKUAADHFC5H</recordid><startdate>20150203</startdate><enddate>20150203</enddate><creator>SONG KI-YONG</creator><creator>YOON YEO-GEON</creator><creator>PARK JI-YOUNG</creator><creator>KIM JAE-HONG</creator><creator>JEONG YU-GWANG</creator><creator>YANG DONG-JU</creator><creator>KIM HEE-JOON</creator><creator>LEE KI-YEUP</creator><creator>CHOI SHIN-IL</creator><creator>YEO YUN-JONG</creator><creator>KIM SANG-GAB</creator><creator>KIM CHANG-HOON</creator><creator>CHO SUNG-HEN</creator><creator>KIM JOO-HAN</creator><scope>EVB</scope></search><sort><creationdate>20150203</creationdate><title>Contact portion of wire and manufacturing method thereof</title><author>SONG KI-YONG ; YOON YEO-GEON ; PARK JI-YOUNG ; KIM JAE-HONG ; JEONG YU-GWANG ; YANG DONG-JU ; KIM HEE-JOON ; LEE KI-YEUP ; CHOI SHIN-IL ; YEO YUN-JONG ; KIM SANG-GAB ; KIM CHANG-HOON ; CHO SUNG-HEN ; KIM JOO-HAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US8946004B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FREQUENCY-CHANGING</topic><topic>NON-LINEAR OPTICS</topic><topic>OPTICAL ANALOGUE/DIGITAL CONVERTERS</topic><topic>OPTICAL LOGIC ELEMENTS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF</topic><toplevel>online_resources</toplevel><creatorcontrib>SONG KI-YONG</creatorcontrib><creatorcontrib>YOON YEO-GEON</creatorcontrib><creatorcontrib>PARK JI-YOUNG</creatorcontrib><creatorcontrib>KIM JAE-HONG</creatorcontrib><creatorcontrib>JEONG YU-GWANG</creatorcontrib><creatorcontrib>YANG DONG-JU</creatorcontrib><creatorcontrib>KIM HEE-JOON</creatorcontrib><creatorcontrib>LEE KI-YEUP</creatorcontrib><creatorcontrib>CHOI SHIN-IL</creatorcontrib><creatorcontrib>YEO YUN-JONG</creatorcontrib><creatorcontrib>KIM SANG-GAB</creatorcontrib><creatorcontrib>KIM CHANG-HOON</creatorcontrib><creatorcontrib>CHO SUNG-HEN</creatorcontrib><creatorcontrib>KIM JOO-HAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONG KI-YONG</au><au>YOON YEO-GEON</au><au>PARK JI-YOUNG</au><au>KIM JAE-HONG</au><au>JEONG YU-GWANG</au><au>YANG DONG-JU</au><au>KIM HEE-JOON</au><au>LEE KI-YEUP</au><au>CHOI SHIN-IL</au><au>YEO YUN-JONG</au><au>KIM SANG-GAB</au><au>KIM CHANG-HOON</au><au>CHO SUNG-HEN</au><au>KIM JOO-HAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Contact portion of wire and manufacturing method thereof</title><date>2015-02-03</date><risdate>2015</risdate><abstract>A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF |
| title | Contact portion of wire and manufacturing method thereof |
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