Method and apparatus for producing multiple-pane insulating glass having a high-vacuum insulation

An apparatus and method for producing an insulating structural element from substrates is provided. The substrates may be connected to one another at a periphery by applied pieces and may be insulated from one another by a vacuum. The apparatus may include a washing device, a cleaning device, a heat...

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Bibliographische Detailangaben
Hauptverfasser:	FRIEDL WOLFGANG, LEITENMEIER STEPHAN
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL FIXED CONSTRUCTIONS FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES,FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS,BLINDS, GATES GLASS HEATING JOINING GLASS TO GLASS OR OTHER MATERIALS LADDERS LIGHTING MACHINE TOOLS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS RANGES SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING VENTILATING WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An apparatus and method for producing an insulating structural element from substrates is provided. The substrates may be connected to one another at a periphery by applied pieces and may be insulated from one another by a vacuum. The apparatus may include a washing device, a cleaning device, a heating device for pre-heating the substrates, a positioning device for positioning the applied pieces on the substrates, an ultrasonic soldering device for soldering the applied pieces to the substrates, an automatic spacer and getter element setting unit, a plasma sputtering device in a vacuum, a substrate displacing device for transporting the substrates, a mechanical substrate placing device for joining the substrates, and a connecting device for welding or soldering the applied pieces of the substrates to each other.