Methods of forming coaxial feedthroughs for 3D integrated circuits

Methods of forming coaxial feedthroughs for 3d integrated circuits that provide excellent isolation of signal paths from the substrate and from adjacent feedthroughs. One method is to form a recess in a substrate and deposit alternate layers of insulation and conductive layers and then thin the subs...

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Bibliographische Detailangaben

Hauptverfasser:	BERGEMONT ALBERT, SRIDHAR UPPILI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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